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Multifunctional Positioning Pressure Reducing Silicon Magic Pad For BGA CPU IC Reballing
- 249 kr
Produktnummer:
7033
1. Especially designed for BGA chips repair.
2. CPU planting tin, dynamic leveling of planting tin net, protect chip more secure.
3. Avoid tin messing caused by the deformation of steel mesh efficiently.
4.Replace the iPhone front camera and infrared camera cable. It is a safer fixture to avoid camera blurring caused by heating.
5. Fixed iPhone fingerprints And dot-matrix flex cable
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